Foam, ESD,Heavy Duty
Specifications
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
Product Description
Foam, ESD,Heavy Duty
Specifications
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
Product Videos
Custom Field
Specifications
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
