Foam, ESD
Specifications
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
Product Description
Foam, ESD
Specifications
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
Product Videos
Custom Field
Specifications
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
This foam is suitable for protection of static sensitive devices and assemblies, shunting of IC leads, and cushion packaging. It is non-sloughing, non-contaminating, and non-corrosive. The material will thermoform into simple shapes.
Features:
Ideal for lead insertion packaging, providing ESD and physical protection to component leads.
Shuntable, brings leads to equipotential, minimizing exposure to discharge.
Conductive crosslink polyethylene foam, RTT < 104 ohms.
Non-contaminating, corrosion resistant, will not affect solderability.
Cross linked foam will not particulate; the choice for critical environments.
3.1 lb/ft density.
Available in small, ready-to-use pieces
MINIMUM QUANTITIES APPLY, PLEASE CALL (800) 718-1010 FOR DETAILS
